The HiFix Board is specifically designed to evaluate the electrical characteristics and performance of a device under test. It plays a crucial role in ensuring accurate signal transmission and power delivery during the testing process.
This board is seamlessly integrated with the Handler, which facilitates the efficient transfer of power and signals between the test system and the device. By acting as an interface, the HiFix Board ensures stable connectivity, minimizes signal loss, and enhances the reliability of test results.
Its robust design and precision engineering make it an essential component in semiconductor and electronics testing environments.
Specification | Unit (mm) | Unit (inch) |
Layer | 100(+) | 100(+) |
Base Material | FR-4 | FR-4 |
Min. Thickness | 1.6-8.4 | 0.063~0.33 |
Conductor Width | 0.045 | 0.0018 |
Conductor Space | 0.06 | 0.0024 |
Hole Diameter | Φ 0.076 | Φ 0.003 |
Surface Treatment | 1.3μm | 50μ” |
Pitch | 0.2 | 0.008 |
Etc | HPL, Back Drill | HPL, Back Drill |
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