The Load Board (SoC) Type Motherboard is a specialized testing interface designed for System-on-Chip (SoC) devices.
It acts as a bridge between the Tester and the device under test (DUT), enabling precise evaluation of electrical characteristics and performance metrics. This board is engineered to handle high-speed signals, power management, and functional testing, ensuring accurate diagnostics and validation of SoC-based components.
With optimized design and high signal integrity, the Load Board (SoC) Type Motherboard is essential in semiconductor testing, improving efficiency and reliability in the evaluation process.
Specification | Unit (mm) | Unit (inch) |
Layer | 100(+) | 100(+) |
Base Material | FR-4 | FR-4 |
Min. Thickness | 1.6-8.4 | 0.063~0.33 |
Conductor Width | 0.055 | 0.0022 |
Conductor Space | 0.07 | 0.0027 |
Hole Diameter | Φ 0.1 | Φ 0.004 |
Surface Treatment | 1.3μm | 50μ” |
Pitch | 0.35 | 0.014 |
Etc | HPL, BUILD-UP | HPL, BUILD-UP |
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