PCB Assembly - Innovative PCB Manufacturing

Vtech PCB’s

VTech PCB Services: Assembly

VTech PCB provides electronics manufacturing services supported by advanced surface mount technology and efficient assembly processes. We focus on delivering high-quality PCB assembly solutions through the right equipment, skilled professionals, and reliable manufacturing systems.

As an electronics manufacturing and design services provider, VTech PCB combines product development, technical expertise, and manufacturing capabilities to support customers with PCB assembly, process optimization, and supply chain solutions tailored to their project requirements.

VTech PCB Assembly Services

Our assembly services are designed to support high-mix, technology-intensive projects, from prototypes to low- and medium-volume production.

Through-Hole Assembly

Whether you require a few through-hole (TH) components to be manually placed or the assembly of an entire PCB, our processes can accommodate a range of requirements. Our trained technicians use manual through-hole workstations and assembly lines to support different production volumes.

We support leaded and lead-free (RoHS-compliant) assembly processes using wave soldering and selective soldering equipment, where required.

Skilled assembly personnel trained in IPC J-STD-001 standards
Manual through-hole assembly
Assembly lines for higher-volume manual assembly
Press-fit connector assembly
Wave and selective soldering for leaded and lead-free (RoHS-compliant) products

Surface Mount Technology (SMT)

VTech PCB offers surface mount technology (SMT) assembly solutions designed to support a wide range of electronic components and PCB configurations. Automated placement and soldering processes help achieve accurate component placement, consistent quality, and efficient production.

Support for components as small as 01005 package size, subject to equipment capability
Compatible package types include QFPs, μBGAs, CSPs, and BGAs, subject to design requirements
Double-sided assembly for rigid and flexible PCBs, where supported
Assembly quality requirements aligned with IPC-A-610 Classes 1, 2, and 3, as applicable
Convection reflow soldering, with nitrogen processing where available

Chip-on-Board (COB) Assembly

Chip-on-board (COB) assembly involves mounting semiconductor dies directly onto a printed circuit board. This approach can offer a cost-effective alternative to conventional semiconductor packaging for suitable applications.

Cleaning Processes and Chemistries

PCB cleanliness is important for assembly quality, product reliability, and long-term performance. Cleaning and flux-management processes should be selected according to component sensitivity, board design, and customer requirements.