High-Fix Board

The HiFix Board is specifically designed to evaluate the electrical characteristics and performance of a device under test. It plays a crucial role in ensuring accurate signal transmission and power delivery during the testing process.

This board is seamlessly integrated with the Handler, which facilitates the efficient transfer of power and signals between the test system and the device. By acting as an interface, the HiFix Board ensures stable connectivity, minimizes signal loss, and enhances the reliability of test results.

Its robust design and precision engineering make it an essential component in semiconductor and electronics testing environments.

Specifications

Specification

Unit (mm)

Unit (inch)

Layer

100(+)

100(+)

Base Material

FR-4
Low Dk
FR-4 High Tg


FR-4
Low Dk
FR-4 High Tg

Min. Thickness

1.6-8.4

0.063~0.33

Conductor Width

0.045

0.0018

Conductor Space

0.06

0.0024

Hole Diameter

Φ 0.076

Φ 0.003

Surface Treatment
(Hard Gold & Electroless Gold Plating)

1.3μm

50μ”

Pitch

0.2

0.008

Etc

HPL, Back Drill

HPL, Back Drill

Structure

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