16+ layer - Innovative PCB Manufacturing

We deliver high-quality, precision-engineered PCBs to power your innovations. Whether you need custom solutions, bulk manufacturing, or fast turnaround, VTech PCB has you covered!

16+ Layer Series

The 16+ Layer Series PCBs are built for precision and performance, featuring advanced multilayer architecture for superior signal integrity and reliability. Designed to handle complex circuits with efficiency, these boards maximize space utilization while ensuring seamless connectivity. Ideal for high-density applications, they deliver exceptional durability and stability in demanding environments.

20L BIB Board

Layer—— 20L
Material —— IT180ATC
Board Thickness—— 2.35±0.1mm
O/I Copper —— 0.5OZ
Min Trace/Space —— 0.072/0.255mm
Min hole —— 0.131mm
Pitch —— 0.30mm
Surface Finish—— ENIG+Gold Fingers

22L IC Test board

Layer —— 22L
Material —— TU865
Thickness —— 3.5mm
Copper —— 1OZ
Min Trace/Space —— 2/2mil
Min Hole —— 0.2mm
Finishing—— Plating Gold 30U

22L ATE Loadboard

Layer —— 22L
Thickness —— 3.5mm
Copper —— 1OZ
Min Trace/Space —— 2/2mil
Min hole —— 0.2mm
Finishing—— Plating Gold

18L Loadboard HALF

Layer —— 18L
Material —— TU865
Thickness —— 3.5mm
Copper —— 1OZ
Min Trace/Space —— 2/2mil
Min Hole —— 0.2mm
Finishing —— Plating Gold

2 Level HDI 24 layers PCB

Layer count —— 24L
Material —— FR-4(Tg180) VT-47
Board thickness —— 2.59+/-0.26mm
Min. LW/LS —— 3.5/5.0mil
Min. Drill Size —— 0.25mm
Surface Finish —— Immersion gold

5G Communication High Speed Products

22 Layer PCB
High Speed Low Loss
2 Lam- L22-3 and L1-22
11 Sets of Back Drill, VIPPO
20 T-Coins 22-3/3-1
10 set of CI Single/Diff
HVLP Copper

16L Xilinx FPGA

Layer—— 16L 3 Step
Material —— Isola FR408HR
Thickness—— 3mm
Copper —— HOZ
Min Trace/Space —— 2/2mil
Min Hole —— 0.15mm
Finishing—— ENEPIG
Application —— FPGA

16L 3 Step HDI (R-5775)

Layer —— 16L 3 Step
Material —— Panasonic R-5775
Thickness —— 2.0mm
Copper —— H OZ
Min Trace/Space—— 2/2 Mil
Min hole —— 0.1mm
Finshing —— ENIG
Application—— Communication Equipment

16L 3 Step Accelerator Card

Layer —— 16L 3 Step
Material —— Panasonic R-5775/R-5760
Thickness—— 1.6mm
Copper —— 1OZ
Min Trace/Space —— 1/1 mil
Min Hole—— 0.15mm
Finishing —— ENIG 3u'+Gold Fingers 60u“
Application —— FPGA

20L DUT 5.5mm

Layer—— 20L
Material —— S1000-2M
Thickness —— 6.35mm
Copper —— 2OZ
Min Trace/Space —— 2/2mil
Min Hole —— 0.2mm
Surface Finish—— ENIG
Application —— PMIC Test Board

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